eSUN PLA+ Filament Review: High-Strength Printing for the New Era

For years, filament spools were a utilitarian afterthought. The eSUN PLA+ transitioned to cardboard spools, a decision that has generated mixed feedback among owners. While the filament itself maintains a reputation for good winding and dimensional accuracy, the cardboard spools introduce what we term the 'AMS friction tax' for users with sensitive material handling systems. Owners of Bambu Lab AMS units, for example, report needing adapter rings or even respooling the material onto plastic spools to ensure smooth operation. The cardboard material can create friction on spindles or accumulate dust in sensitive feeding mechanisms. Shipping damage to these spools is also a recurring complaint, although the filament itself typically remains unaffected.

The eSUN PLA+ generally earns high marks for ease of printing. Many owners report successfully using default slicer settings, including those optimized for standard PLA on popular machines like Bambu Lab P1P/X1 and Ender 3 series printers. The material's low shrinkage properties contribute to stable prints with minimal warping or cracking, simplifying the calibration process. However, a significant theme emerging from owner feedback is the 'dry-before-you-print' imperative. Specifically, recent batches of black eSUN PLA+ have arrived with notable moisture content, manifesting as popping and stringing during printing. While drying the filament resolves these issues, it adds an extra step not always expected from a new spool.

The core promise of PLA+ is enhanced strength, and owners largely confirm this. Parts printed with eSUN PLA+ are described as 'surprisingly tough' and 'more durable' than those made with standard PLA, suitable for functional components and even demanding applications like 3D printed tools. It prints well at high speeds, making it a strong match for high-speed core-XY machines. Adhesion to common print surfaces like textured PEI is generally excellent, even without adhesives. However, some users note the 'cosmetic color shift' phenomenon, where the printed color, especially with certain hues like red or green, may appear less vibrant or slightly different than what is seen on the spool. This is an important distinction for projects where exact color matching is critical.

eSUN PLA+ operates within a broad ecosystem of FDM 3D printers and slicer software, indicating its high compatibility. While some users opt to respool for AMS systems to leverage their RFID detection, the filament functions well with generic PLA or PLA+ profiles across various slicers. The manufacturer lists compatibility with a wide range of popular printers, including Bambu Lab, K1, Prusa, and Ender series, and owner experiences corroborate this. The material's robustness means users often do not need to stray far from standard settings, translating to a straightforward integration into existing printing workflows without extensive profile tuning. This broad compatibility underscores its utility as a general-purpose, enhanced PLA.

Priced around $15 to $20, eSUN PLA+ is frequently lauded as excellent value. Many consider it their 'go-to' filament due to its balance of cost, strength, and printability. Its reliability is high once moisture is addressed, with owners reporting consistent results across multiple rolls and over extended periods. The sentiment is that for the price, the strength increase and ease of use are difficult to match. The principal trade-off in the value equation centers on the cardboard spools; while they reduce manufacturing costs, they incur a 'usability cost' for some advanced printer setups, which may necessitate additional accessories or time spent preparing the filament before use. This indirect cost can impact the overall perceived value for specific user groups.